Production of three-dimensional, injection-molded circuit carriers and integration of mechanical, electronic, thermal, fluid and optical functions in components of almost any shape.
MID (Mechatronic Integrated Devices) technology enables the manufacture of three-dimensional, injection- molded circuit carriers and the integration of mechanical, electronic, thermal, fluidic and optical functions in components of virtually any shape. The associated advantages result in an increased degree of miniaturiza- tion, the implementation of new functions and applications,
and the shortening of process chains.
Laser direct structuring can be used to efficiently create conductor path structures on three-dimensional compo- nents.
In a project funded by ESA, MID technology was used in a sun sensor. Compared with the conventional design, the new structure based on MID technology is only a quarter of the weight and half the height. This means that the sun sensor can also be used in cubesats. In addition, with the new setup, the effort required to align important sensor compo- nents, which is crucial for measurement accuracy, can be reduced by two-thirds. The tests carried out were passed suc- cessfully.